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  BD6376GUL product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/11 tsz02201-0h3h0b600310-1-2 ? 2012 rohm co., ltd. all rights reserved. 3.aug.2012 rev.001 www.rohm.com tsz22111 ? 14 ? 001 datashee t driver for digital still camera 1-2ch lens drivers for slrs(single-lens reflex) BD6376GUL general description the BD6376GUL motor driver provides 1 full-on driver h-bridge channel. this driver features wide range operating from 2.0v and low power consumption by fast switching speed. in addition, in a compact surface mount package adopt small mobile system, home appliance, and amusement system etc. features ? low on-resistance power dmos output upper & lower total: 0.45 ? (typ.) ? range of motor power supply voltage: 2.0 to 9.0v ? charge pump-less type with p-channel dmos for the upper side transistor ? maximum output current for h-bridge: 1.0a dc ? high-speed switching: turn on time: 200ns, turn off time: 60ns(typ.) ? with built-in under voltage locked out protection and thermal shut down circuit ? stand-by current: 0a (typ.) applications ? small mobile system ? home appliance ? amusement system, etc key specifications ? power supply voltage range(v cc ): 2.5 to 3.6v ? motor power supply voltage range(v m ): 2.0 to 9.0v ? circuit current (open mode): 360a (typ.) ? stand-by current: 1a(max.) ? control input voltage: 0 to v cc v ? logic input frequency: 200khz(max.) ? minimum logic input pulse width: 0.5s(min.) ? turn on time: 200ns(typ.) ? turn off time: 60ns(typ.) ? output on-resistance (total): 0.45 ? (typ.) ? operating temperature range: -30 to +85 package w(typ.) x d(typ.) x h(max.) vcsp50l1 1.60mm x 1.60mm x 0.55mm ordering information b d 6 3 7 6 g u l -e 2 part number package gul: vcsp50l1 packaging and forming specification e2: embossed tape and reel vcsp50l1
2/11 datasheet d a t a s h e e t BD6376GUL tsz02201-0h3h0b600310-1-2 ? 2012 rohm co., ltd. all rights reserved. 3.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 block diagram / application example pin configuration pin description 1 2 3 a vcc gnd ps b vm inb ina c outa pgnd outb no. name function a1 vcc power supply terminal a2 gnd ground terminal a3 ps power-saving terminal b1 vm motor power supply terminal b2 inb control input terminal b b3 ina control input terminal a c1 outa h-bridge output terminal a c2 pgnd motor ground terminal c3 outb h-bridge output terminal b figure 2. pin configuration (top view) table 1. pin description figure 1. block diagram / application example power-saving h: active l: stand-by motor control input bypass filter capacitor for power supply input bypass filter capacitor for power supply input
3/11 datasheet d a t a s h e e t BD6376GUL tsz02201-0h3h0b600310-1-2 ? 2012 rohm co., ltd. all rights reserved. 3.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings(ta=+25 ) parameter symbol limit unit power supply voltage v cc -0.3 to +4.5 v motor power supply voltage v m -0.3 to +10.0 v control input voltage v in -0.3 to v cc +0.3 v power dissipation pd 725 *1 mw h-bridge output current (dc) i out 1.0 *2 a storage temperature range t stg -55 to +150 junction temperature t jmax +150 *1 reduced by 5.8mw/c over 25c, when mounted on a glass epoxy 8 layers board (50mm 58mm 1.75mm) *2 must not exceed pd, aso, or tjmax of 150c. recommended operating ratings parameter symbol limit unit power supply voltage v cc 2.5 to 3.6 v motor power supply voltage v m 2.0 to 9.0 v control input voltage v in 0 to v cc v logic input frequency f in 0 to 200 khz min. logic input pulse width t in 0.5 s operating temperature range t opr -30 to +85
4/11 datasheet d a t a s h e e t BD6376GUL tsz02201-0h3h0b600310-1-2 ? 2012 rohm co., ltd. all rights reserved. 3.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless ot herwise specified ta=+25c, v cc =3.0v, v m =5.0v) parameter symbol limit unit condition min. typ. max. all circuits stand-by current i ccst - 0 1 a v ps =0v circuit current 1 i cc1 180 360 550 a v ps =3v, open mode circuit current 2 i cc2 180 375 550 a v ps =3v, cw & ccw mode circuit current 3 i cc3 180 375 550 a v ps =3v, short brake mode ps input (ps) high-level input voltage v psh 2.0 - v cc v low-level input voltage v psl 0 - 0.7 v high-level input current i psh 6 15 30 a v ps =3v low-level input current i psl -1 0 1 a v ps =0v control input (ina, inb) high-level input voltage v inh 2.0 - v cc v low-level input voltage v inl 0 - 0.7 v high-level input current i inh 6 15 30 a v in =3v low-level input current i inl -1 0 1 a v in =0v under voltage locked out (uvlo) uvlo voltage v uvlo 2.0 - 2.4 v full on type h-bridge driver output on-resistance r on - 0.45 0.60 ? i out = 500ma, upper & lower total turn on time t on - 200 400 ns 20 ? loading turn off time t off - 60 400 ns 20 ? loading
5/11 datasheet d a t a s h e e t BD6376GUL tsz02201-0h3h0b600310-1-2 ? 2012 rohm co., ltd. all rights reserved. 3.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves (reference data) 0.0 1.0 2.0 3.0 4.0 5.0 01234 supply voltage : v cc [v] circuit current : i cc [a] 0 50 100 150 200 250 300 0 200 400 600 800 1000 output current : i out [ma] output vds : v dsh [mv] 0 50 100 150 200 250 300 0 200 400 600 800 1000 output current : i ou t [ma] ou tput vds : v dsl [mv] 0.0 0.5 1.0 1.5 01234 supply voltage : v cc [v] circuit current : i cc [ma] figure 3. circuit current(stand-by mode) figure 4. circuit current(open mode) figure 5. output on-resistance on high-side v m =5v, v cc =3v figure 6. output on-resistance on low-side v m =5v, v cc =3v operating range ( 2.5v to 3.6v ) operating range ( 2.5v to 3.6v ) top 85c mid 25c low -30c top 85c mid 25c low -30c top 85c mid 25c low -30c top 85c mid 25c low -30c
6/11 datasheet d a t a s h e e t BD6376GUL tsz02201-0h3h0b600310-1-2 ? 2012 rohm co., ltd. all rights reserved. 3.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 0.0 0.2 0.4 0.6 0.8 1.0 0246810 supply voltage : v m [v] output on resistance : r on [ ? ] figure 7. output on-resistance on high-side v m dependency, v cc =3v figure 8. output on-resistance on low-side v m dependency, v cc =3v 0.0 0.2 0.4 0.6 0.8 1.0 0246810 supply voltage : v m [v] output on resistance : r on [ ? ] operating range (2.0v to 9.0v) operating range (2.0v to 9.0v) top 85c mid 25c low -30c top 85c mid 25c low -30c
7/11 datasheet d a t a s h e e t BD6376GUL tsz02201-0h3h0b600310-1-2 ? 2012 rohm co., ltd. all rights reserved. 3.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 description of blocks 1) power-saving function when low-level voltage is applied to ps pin, the ic will be turned off internally. during operating mode, ps pin should be high-level. (see the electrical characteristi cs; p4/11, and timing chart; p7/11) 2) control input; ina and inb these pins are used to program and control the motor drive modes. (see the electrical characteristi cs; p4/11, and timing chart; p7/11) timing chart input mode input output ps ina inb outa outb output mode in/in h l l z z open h l h l cw l h l h ccw h h l l short brake - l x x z z open l: low, h: high, x: don?t care, z: hi impedance ps=high; operation mode, ps=low; stand-by mode cw: current flows from outa to outb, ccw: current flows from outb to outa figure 9. input-output ac definition 0% v cc 0v 50% 100% motor current control input t on t off 50%
8/11 datasheet d a t a s h e e t BD6376GUL tsz02201-0h3h0b600310-1-2 ? 2012 rohm co., ltd. all rights reserved. 3.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 power dissipation i/o equivalence circuit ps ina, inb vm, pgnd, outa, outb outa pgnd vm outb 200k ? 10k ? 200k ? 10k ? 0 200 400 600 800 1000 0 25 50 75 100 125 150 ambient temperature : ta [c] power dissipation : pd [mw] figure 10. power dissipation curve figure 11. i/o equivalence circuit 725mw 377mw 85
9/11 datasheet d a t a s h e e t BD6376GUL tsz02201-0h3h0b600310-1-2 ? 2012 rohm co., ltd. all rights reserved. 3.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1) absolute maximum ratings use of the ic in excess of absolute maximum ratings su ch as the applied voltage or operating temperature range (topr) may result in ic damage. assumptions should not be made regarding the state of the ic (short mode or open mode) when such damage is suffered. the implementation of a physical safety measure such as a fuse should be considered when use of the ic in a special mode where the absolute maximum ratings may be exceeded is anticipated. 2) power supply pins and lines none of the vm line for the h-bridge is internally connected to the vcc powe r supply line, which is only for the control logic or analog circuit. theref ore, the vm and vcc lines can be driven at different voltages. although these lines can be connected to a common power supply, do not open the power supply pin but connect it to the power supply externally. regenerated current may flow as a result of the motor's back electromotive force. insert capacitors between the power supply and ground pins to serve as a route for regenerated current. determine the capacitance in full consideration of all the char acteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low temperatures. if the connected po wer supply does not have sufficient current absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. it is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and ground pins. for this ic with 2 power supplies and a part consists of th e cmos block, it is possible that rush current may flow instantaneously due to the internal powering sequence and del ays, and to the unstable internal logic, respectively. therefore, give special consideration to power coup ling capacitance, width of power and ground wirings, and routing of wiring. 3) ground pins and lines ensure a minimum gnd pin potential in all operating conditi ons. make sure that no pins are at a voltage below the gnd at any time, regardless of whether it is a transient signal or not. when using both small signal gnd and large current pgnd pa tterns, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause vari ations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. the power supply and ground lines must be as short and thick as possible to reduce line impedance. 4) thermal design use a thermal design that allows for a sufficient margin in light of the power dissipat ion (pd) in actual operating conditions. 5) actions in strong magnetic field use caution when using the ic in the presence of a strong magnetic field as doing so may cause the ic to malfunction. 6) aso when using the ic, set the output transistor for the motor so that it does not exceed absolute maximum ratings or aso. 7) thermal shutdown circuit this ic incorporates a tsd (thermal shutdown) circuit. if the temperature of the chip reaches the following temperature, the motor coil output will be opened. the tsd circuit is designed on ly to shut the ic off to prevent runaway thermal operation. it is not designed to protect the ic or guar antee its operation. do not continue to use the ic after operating this circuit or use the ic in an en vironment where the operation of this circuit is assumed. tsd on temperature [c] (typ.) hysteresis temperature [c] (typ.) 175 20 8) application example the application circuit is recommended for use. make sure to confirm the adequacy of the characteristics. when using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components incl uding static and transitional characteristics as well as dispersion of the ic. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document, formal version takes priority. figure 12. example of simple ic architecture resistor transistor (npn) parasitic element other adjacent elements parasitic element n n n p + p + p p substrate gnd pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a parasitic element pin b e b c gnd
10/11 datasheet d a t a s h e e t BD6376GUL tsz02201-0h3h0b600310-1-2 ? 2012 rohm co., ltd. all rights reserved. 3.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information marking diagram 3 p=0.52 9- 0.250.05 1.60.05 2 b c ( 0.15)index post s 1 a a 0.05 0.55max b p=0.52 b 1.60.05 s 0.06 a 1pin mark 0.30.05 0.10.05 0.30.05 6376 lot no. vcsp50l1 (top view) part number marking lot number 1pin mark 6376
11/11 datasheet d a t a s h e e t BD6376GUL tsz02201-0h3h0b600310-1-2 ? 2012 rohm co., ltd. all rights reserved. 3.aug.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 3.aug.2012 001 new release
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.


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